
Contents
About This Document.....................................................................................8
Book Layout.............................................................................................................................8
Intended Audience....................................................................................................................8
Publishing History.....................................................................................................................8
Related Information...................................................................................................................8
Typographic Conventions...........................................................................................................9
HP contact information............................................................................................................10
Documentation feedback.........................................................................................................10
1 HP Integrity rx8640 Server Overview..........................................................11
Detailed Server Description......................................................................................................11
Dimensions and Components..............................................................................................11
Front Panel........................................................................................................................14
Front Panel Indicators and Controls..................................................................................14
Enclosure Status LEDs.....................................................................................................14
Cell Board........................................................................................................................14
PDH Riser Board...........................................................................................................15
Central Processor Units..................................................................................................16
Memory Subsystem.......................................................................................................16
DIMMs .......................................................................................................................17
Cells and nPartitions...........................................................................................................17
Internal Disk Devices .........................................................................................................18
System Backplane..............................................................................................................19
System Backplane to Cell Board Connectivity....................................................................19
System Backplane to Core I/O Card Connectivity..............................................................19
System Backplane to PCI-X Backplane Connectivity............................................................20
Clocks and Reset...........................................................................................................20
PCI/PCI-X I/O Subsystem....................................................................................................20
PCIe Backplane............................................................................................................22
PCIe Slot Boot Paths......................................................................................................23
Core I/O Card.............................................................................................................24
Core I/O Boot Paths.................................................................................................24
Mass Storage (Disk) Backplane.......................................................................................25
2 System Specifications................................................................................26
Dimensions and Weights.........................................................................................................26
Electrical Specifications...........................................................................................................27
Grounding........................................................................................................................27
Circuit Breaker...................................................................................................................28
System AC Power Specifications...........................................................................................28
Power Cords.................................................................................................................28
System Power Specifications............................................................................................28
Environmental Specifications....................................................................................................29
Temperature and Humidity..................................................................................................29
Operating Environment..................................................................................................29
Environmental Temperature Sensor...................................................................................30
Non-Operating Environment...........................................................................................30
Cooling............................................................................................................................30
Internal Chassis Cooling................................................................................................30
Bulk Power Supply Cooling.............................................................................................31
PCI/Mass Storage Section Cooling..................................................................................31
Standby Cooling...........................................................................................................31
Contents 3
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